None of these advantages invent you a novel radio technology that is competitive with 5G yet unencumbered by existing patents. Designing a modem to spec is the easy part.
You can draw a small amount of current from the logic signal in high state and store it in a small amount of capacitance, a low enough power device would be able to operate off of it. There is a class of sensors which use and interface called 1-wire which is ground and signal/power (2 pins).
You don't need a very accurate clock (quartz) for ~100 Mhz SPI. A ring oscillator is just a chain of inverters. If you want to match the bus frequency accurately you can train a PLL against the signal clock.
Not sure what the point is about the pullup, to flip the bit you need only to overpower the output buffers of the other chip.
Cramming it all in a 0402 would be a stretch but I could see it being possible with the right resources. Having only 2 pins would be pretty useless if you can't snoop the address though. And modern NOR devices on a motherboard is almost certainly using the high speed 4 pin serial interface rather than standard SPI.
What do you do with 8MB when the OS is 512MB+? Adding NOR Flash is normally pretty simple -- No bad blocks and a standard SPI interfaces most embedded devices have controllers for. The high end controllers can typically map NOR flash directly into the system address space.
Raw NAND is highly preferable to SD or USB drives. You can at least have wear leveling in the OS/FS. SD/USB are bad because most have dumb controllers and just rewrite a page when it changes. Raw NAND is also consistent and meets datasheet specs, whereas SD you never know what you are getting.
> The number of electrons in a flash memory cell is in two digits.
I had worked on one of the last TLC NAND designs before the transition to 3D. You could only afford to leak 1 electron per year to meet the data retention spec... TLC did not make it market on that process/node.
Tampering with evidence, which includes destroying evidence is also a crime. IANAL so I'm not sure at what point a phone becomes evidence, i.e. once there is a indictment, once there is a warrant, t=0, etc. John Carmack got in trouble for deleting emails in that IP case if I recall. A better privacy feature might be that the phone stores no history.
Reminds me of an article about some powerful men on wall street that do not use email. Doing most of your written communication through an assistant would give you a great deal of plausible deniability. Also reminds me of someone else constantly in the news these days.
Intel and AMD already provide most of the necessary code to motherboard manufacturers. Why would a motherboard manufacturer want to share their code with their competitors?
Intel lost out on the mobile revolution because the mobile revolution was about radio technology and not processor technology. Outside of buying Qualcomm for patents and radio designs, anything Intel could have tried was doomed to fail.
I would not rule out 3D from processors yet. Such an invention would be able to reduce die size and likely cost. Heat density is probably the real problem and may need some additional inventions.
The 3D memories will probably see some planar (x-y) scaling, they just don't need all of their scaling from it. 3D scaling will still increase bits/die area, and thus reduce $/bit. If doubling the stacking height doubles capacity but adds 30% to wafer cost with extra processing steps, its still much more efficient than 100% cost for two wafers of the previous design.
Scaling efficiency shouldn't be too dissimilar from planar scaling, at least until the next wall is hit.